Samsung's initial course of action was 10LPE (10 minimal-energy Early) which was replaced by next generation developed method 10LPP (ten very low-energy moreover). Samsung intends to introduce a third generational enhanced 10nm approach known as 8LPP (8 reduced electrical power Plus) that will further improve general performance and introduce a little density boost by cell enhancements and a narrower metallic pitch.
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Due to advertising names, geometries change enormously amongst major manufacturers. Even though each TSMC and Samsung's 10nm processes are slightly denser than Intel's 14nm in raw logic density, These are much closer to Intel's 14nm than They may be to Intel's 10nm (e.g., Samsung's metal pitch just 1 nanometer shorter than Intel's 14nm).